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| Lapping Polishing Basic |
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This machine is suitable for lapping and polishing of silicon piece, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic piece and other hard and fragile metal or non-metal materials.
specification
1. Lapping plate diameter: :φ924×φ358×30 (mm)
2.Max. Diameter of work piece: Ф270mm
3.Achieved parallelism of work piece: 0.2μ(Ф10)
4.Carrier specifications: DP12 (in British system), Z=147
5.Number of carriers: 6 pcs
6.Min. thickness of work piece: 0. 15mm(Ф10)
7.Main motor (AC):, 5.5kw (for lapping) 7.5kw (for polishing)
8.Speed of lower lapping plate: 0 to 60 rpm
9.Slurry pump: 370W
10.Slurry flow type: by circle or drop
11.Machine dimensions (W×L×H): 1250×1540×2780mm
12.Machine net weight: Approx. 3400Kg
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